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Power Transistors
2SD2000
Silicon NPN triple diffusion planar type
Unit: mm
0.70.1
For power switching Features
* High-speed switching * Satisfactory linearity of forward current transfer ratio hFE * Large collector power dissipation PC * Full-pack package which can be installed to the heat sink with one screw.
16.70.3
10.00.2 5.50.2
4.20.2
4.20.2 2.70.2
7.50.2
3.10.1
Solder Dip (4.0)
1.40.1
1.30.2 0.5+0.2 -0.1
Absolute Maximum Ratings TC = 25C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Base current Collector power dissipation Junction temperature Storage temperature Ta = 25C Tj Tstg Symbol VCBO VCEO VEBO IC ICP IB PC Rating 80 60 6 4 8 1 35 2.0 150 -55 to +150 C C Unit V V V A A A W
14.00.5
0.80.1
2.540.3 5.080.5
123
1: Base 2: Collector 3: Emitter EIAJ: SC-67 TO-220F-A1 Package
Electrical Characteristics TC = 25C 3C
Parameter Collector-emitter voltage (Base open) Base-emitter voltage Collector-base cut-off current (Emitter open) Emitter-base cut-off current (Collector open) Forward current transfer ratio Symbol VCEO VBE ICBO IEBO hFE1 * hFE2 Collector-emitter saturation voltage Transition frequency Turn-on time Storage time Fall time VCE(sat) fT ton tstg tf Conditions IC = 25 mA, IB = 0 VCE = 4 V, IC = 4 A VCB = 80 V, IE = 0 VEB = 6 V, IC = 0 VCE = 4 V, IC = 1 A VCE = 4 V, IC = 4 A IC = 4 A, IB = 0.4 A VCE = 12 V, IC = 0.2 A, f = 10 MHz IC = 4 A, IB1 = 0.4 A, IB2 = - 0.4 A, VCC = 50 V 80 0.3 1.0 0.2 70 20 1.5 V MHz s s s Min 60 2.0 100 100 250 Typ Max Unit V V A A
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Rank hFE1 Q 70 to 150 P 120 to 250
Publication date: September 2003
SJD00238BED
1
2SD2000
PC Ta
40
(1)
IC VCE
Collector-emitter saturation voltage VCE(sat) (V)
4
IB=40mA TC=25C
VCE(sat) IC
100
IC/IB=10
Collector power dissipation PC (W)
Collector current IC (A)
30
(1)TC=Ta (2)With a 100x100x2mm Al heat sink (3)With a 50x50x2mm Al heat sink (4)Without heat sink (PC=2W)
35mA
3
30mA 25mA 20mA
10
20
2
15mA 10mA
1
10
(2) (3) (4)
TC=100C
1
5mA
0.1
25C
-25C
0
0
40
80
120
160
0
0
2
4
6
8
0.01 0.01
0.1
1
10
Ambient temperature Ta (C)
Collector-emitter voltage VCE (V)
Collector current IC (A)
VBE(sat) IC
100
IC/IB=10
hFE IC
104
VCE=4V
fT I C
1 000
VCE=12V f=10MHz TC=25C
Base-emitter saturation voltage VBE(sat) (V)
Forward current transfer ratio hFE
10
103
TC=100C
Forward current transfer ratio hFE
10
100
1
25C
TC=-25C 100C
102
25C
-25C
10
0.1
10
1
0.01 0.01
0.1
1
10
1 0.01
0.1
1
0.1 0.01
0.1
1
10
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
Cob VCB
Turn-on time ton , Storage time tstg , Fall time tf (s)
ton, tstg, tf IC
100
IE=0 f=1MHz TC=25C
Safe operation area
100
Non repetitive pulse TC=25C
Collector output capacitance C (pF) (Common base, input open circuited) ob
104
Collector current IC (A)
103
10
Pulsed tw=1ms Duty cycle=1% IC/IB=10(IB1=-IB2) VCC=50V TC=25C
10
ICP IC t=1ms DC
tstg
102
1
ton
1
10
0.1
tf
0.1
1
0.01
0.01
1
10
100
1 000
0
2
4
6
8
1
10
100
1 000
Collector-base voltage VCB (V)
Collector current IC (A)
Collector-emitter voltage VCE (V)
2
SJD00238BED
2SD2000
Rth t
104
Note: Rth was measured at Ta=25C and under natural convection. (1)Without heat sink (2)With a 100x100x2mm Al heat sink
Thermal resistance Rth (C/W)
103
102
(1)
10
(2)
1
10-1 10-4
10-3
10-2
10-1
1
10
102
103
104
Time t (s)
SJD00238BED
3
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL
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